Suzhou million Belts and billion Roads Electronic Technology Co,.Ltd

By realizing data interconnection between the DIP solder joint detection equipment and the automatic repair equipment, automatic inspection and rework of DIP solder joints are achieved, thus reaching the automation goal of the DIP line.
The software is designed in a modular way, and parameters can be adjusted humanely according to different process requirements.
Automatically optimize the maintenance path for rapid repair.
The bottom shooting structure is seamlessly connected with the wave soldering.
The inspection results are accurate and the rework precision is high.

Inspection items:
For DIP: absence of solder, insufficient solder, excessive solder, voids, short circuits, copper presence, false soldering, buried pins, solder balls, foreign substances.
For SMT: incorrect parts, missing parts, reversed placement, misalignment, tombstoning, standing on side, flipped parts, damage, short circuits, insufficient solder, cold solder joints, open solder joints, glue overflow, exposed copper, rough pins, pin deformation.
◆ Minimum component :Chip: 01005, Pitch: 0.3
XY dual-drive linear motion realizes high speed and high precision.
High speed and high precision, continuous stability and low wear.
Superior detection ability and lower false alarm rate.
Independent track: can be through-connected, supports communication, and is compatible with NG Buffer, reducing personnel allocation.